RESPONSIBILITIES:
1. Support DPS engineering team and external suppliers in wafer grinding, dicing, and TnR processes.
2. Work in a dynamic collaborative team environment.
3. Apply problem solving skills and knowledge to solve challenges related to new technologies or improve existing processes.
4. Prepare product/process reports by collecting, analyzing, and summarizing information.
5. Provide engineering information by answering questions and requests.
6. Contribute to team effort by accomplishing related results as needed.
7. Integrate new technology into existing processes.
8. Develop, qualify and support clean launch of new DPS processes with documentation.
9. Utilize program management methodology to plan, execute and monitor complex processes and/or product development projects.
10. Travel to factories and suppliers to provide technical support.

REQUIREMENT/ QUALIFICATIONS:
• Minimum of a BS or higher in engineering (Process/ Packaging/ Mechanical/ Electronics)
• Having at least 5 years of experience is required.
• Learn fast in a high paced environment.
• Foundation in lean manufacturing principles and ability to utilize structured problem-solving methodologies (e.g. DMAIC, 8D) preferred.
• Ability to self-start and work independently.
• Ability to work flexible hours and/or travel depending on the needs of the business.
• Effective project management skills
• Strong time management, organizational skills, and ability to set priorities for multiple tasks.
• High level of customer focus both internally and externally.
• Fluent in Microsoft Office products (Excel, Word, PowerPoint, etc.).
• Foundation in solid modeling and TIBCO Spotfire preferred.
• Experience with wafer thinning, dicing (laser and blade) and DTR processes is a plus.
• Proficient in English.
BENEFITS:
• Learn & work with world-class design engineers and IC products
• Dynamic, technological, global working environment
• Performance review to adjust salary and title/position.
• 13 months of salary, bonus paid twice a year and many other side benefits such as lunch allowance, healthcare program, annual health-screen, sport activities, gifts on special occasions etc.,